MECHANIC XGS P50 Special Solder Paste

For high-precision electronics rework, particularly in smartphone and BGA chip repair, the MECHANIC XGS P50 Special Solder Paste delivers unmatched accuracy and reliability.

Formulated with Sn63/Pb37 alloy and ultra-fine ~3 µm solder powder, it ensures smooth, even solder flow and excellent pad coverage. Its IPX3-grade rosin flux offers strong oxidation resistance and prevents corrosion on sensitive PCB surfaces . With a sharp melting point of 183 °C, it’s perfectly tuned for both hot-air and reflow processes, avoiding damage to delicate components.

Packaged in a 42 g syringe, this paste allows clean, controlled application for small SMD devices and BGA chips—making it ideal for smartphone motherboard repairs, FPV drone electronics, embedded IoT boards, and fine engineering prototypes.

🛠 Technical Details

⚠️ Precautions & Safety Tips

• Use controlled hot-air or reflow ovens set at ~183 °C.

• Always work in a well-ventilated area to reduce flux vapor exposure.

• Avoid overexposure—it can damage pads or delaminate PCB layers.

• Store in a cool, dry place to maintain consistency.

• Dispose of unused paste per local electronic waste regulations.

💡 Use Cases & Applications

The MECHANIC XGS P50 Solder Paste is highly recommended for:

• Smartphone & BGA IC Repair
  Excellent for mobile motherboard fixes, chip-level rework, and refurbishment of devices.

• Precision PCB Rework
  Ideal for cleaning and soldering fine-pitch SMD parts on electronics components boards.

• Drone Electronics & FPV Gear
  Uses in tight-profile PCB repairs in drone systems.

• IoT and Embedded Device Rework
  Perfect for soldering intricate IoT modules and sensor arrays.

• STEM Training & Technical Labs
  Great for teaching fine soldering techniques in educational and prototyping environments.

🛠️ Pair With

• Tools and Accessories

• Electronics Components

• IoT & Smart Solutions

• Drones

🎥 YouTube Tutorial

Watch this professional walkthrough on SMD chip reballing with fine solder paste using hot-air and stencils.

🏁 Conclusion & Value Proposition

When precise, clean, and controlled solder application is critical, the MECHANIC XGS P50 Special Solder Paste (42 g) is your go-to. It combines fine-grain alloy, professional-grade flux, and easy-to-use packaging, making it essential for advanced electronics repair, prototype development, and drone & IoT board refinements.

Available now at Electroway — elevate your fine-soldering workbench today.